Intel Capital - Portfolio Company: FlexICs


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FlexICs
(UNITED STATES)

165 Topaz Street
Milpitas, CA 95035
UNITED STATES
PH: 408-262-3441
FAX: 408-262-3880

www.flexics.com

FlexICs is a leading developer of Ultra Low Temperature Semiconductor Processing (ULTSP) technology that allows integrated circuits to be built on plastic. This breakthrough technology will enable shatterproof, lightweight, thin and flexible displays for next generation PDAs, cell phones and notebook PCs. Other applications include memory modules, optical component integration and imaging.

Magnus Ryde, CEO
Magnus Ryde has more than 20 years of experience in the semiconductor industry. Before joining FlexICs, he served as president of TSMC (Taiwan Semiconductor Manufacturing Company), North America. Previously, he was a corporate officer and vice president of KLA-Tencor responsible for worldwide sales, service and support. He also held several senior management positions at KLA before the KLA-Tencor merger. Ryde holds a M.S. in Industrial Engineering from Stanford University.

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