United States Home | Select a Location
Site Map | Contact Us | About Intel
Advanced Search
Home ComputingBusinessDeveloperReseller / Provider
  Search Developer site
Networking and Communications Building Blocks

Product Index
Building Blocks
Design Solutions
Related Sites
Where to Buy
Intel(R) NetStructure(TM) ZT 5085 12U Redundant Host Packet Switched Platform

Product Information
Product Brief

Sign up
for more information
Related Products
Intel� NetStructure� ZT 5524
Intel� NetStructure� ZT 5504
Intel� NetStructure� ZT 4807
Intel� NetStructure� ZT 8101
Intel� NetStructure� ZT 7101
Where to Buy

ZT 5085
This packet switched platform features a PICMG* 2.16-compatible midplane supporting redundant-host architecture for I/O-intensive applications. It is one of several modular telecom building blocks from Intel, providing OEM equipment designers with a carrier-grade, standards based, high availability computing platform for demanding mission-critical applications.

The Intel� NetStructure� ZT 5085 12U Redundant Host Packet Switched Platform supports five-nines (99.999%) availability with built-in redundancy for active system components including Ethernet switches, chassis management modules, power supplies and fan trays. Redundant chassis management modules enable customers to manage multiple SBCs and conduct chassis diagnostics remotely for enhanced system reliability. Ethernet signals are routed across the midplane without the use of cables, saving time in set-up, maintenance and repair, and minimizing the thermal challenges of traditional cabling methods.

The ZT 5085 platform is designed to interoperate with all members of the Intel� NetStructure� family of packet switched products, and with third-party boards meeting the PICMG 2.16 specifications.


  • 12U, 19-inch rack-mount enclosure
  • 21 slots (18 node slots, two fabric slots, and two 3U chassis management slots)
  • Four hot-swappable redundant-host slots for active/active or active/standby control-plane operation
  • Twelve 64-bit peripheral slots with H.110 telephony bus and rear-panel I/O
  • Up to 50W per node slot and 80W per fabric slot power and cooling
  • Designed for NEBS Level 3 and ETSI installations
  • Five-nines availability
  • Redundant, hot-swappable modules for fault recovery
    • Redundant-host system masters (Optional)
    • Two PICMG 2.16-compliant 10/100/1000 fabric slots
    • Two IPMI-based chassis management modules (CMMs)
    • N+1 cooling architecture
    • N+N load-sharing 250W AC or DC power supplies
  • Redundant power input (front- or rear-panel cabling)
  • Multiple midplane configuration options
  • Two PCI bus segments with H.110 support
  • 21 rear-panel I/O slots (18 node slots, two fabric slots, and two 3U CMM slots)
  • IPMI-based, PICMG 2.9-compliant redundant chassis management modules
  • Unique star topology for increased reliability and security
  • All Field-Replaceable Units (FRUs) serviceable from the front (except RTMs)

Back to Top

*Legal Information  |  Privacy Policy
©2002 Intel Corporation