United States Home | Select a Location
Site Map | Contact Us | About Intel
Advanced Search
Home ComputingBusinessDeveloperReseller / Provider
  Search Developer site
Developers' Web Site Help
* Packaging Data
* Products

Improvements to Intel�s Package Certification Methodology

Intel is improving the way we certify package technologies by converting to a knowledge based certification methodology utilizing use conditions. This change does not impact quality in any way. Rather it is a transition from standards-based reliability to knowledge-based reliability and it emulates our silicon certification methodology that has been in use at Intel for the past decade. The silicon certification methodology has been refined over many technology generations and has a proven track record of delivering high quality and reliability.

The new package certification methodology provides a number of benefits to the customer. First, there will be a lower risk due to a better understanding of the use environments and their relationship to the accelerated reliability tests. Second, there will be faster product introductions because envelope expansions can be evaluated more quickly and thoroughly. Finally, this methodology helps ensure a stable supply chain of needed materials for future technologies through the elimination of custom materials and longer development times.

This methodology is an improvement over the old package certification methodology for a number of reasons. The old methodology was only reviewed in response to extremely significant changes, e.g. the "popcorn" failures during the surface mount package introduction of the mid-eighties. The new methodology has automatic review cycles of the methods, testing, and environment for every new technology generation. The old methodology is fixed and doesn�t easily accommodate new requirements whereas the new methodology scales to match the requirements of the new technology environment. The old methodology is based on standard stresses and the new technology is based on product lifetime. Finally, the old methodology has a limited understanding of process margins and the new methodology gives us a much more accurate prediction of lifetime performance and margins. The fundamental principle of the new methodology is the characterization of the different failure mechanisms against the Use Conditions to model and assess the failure rate over the lifetime of the device. Intel conducted a market study to better understand the use environment in which our computer related products are being used. This study included data from various market research companies and a survey of Intel�s major customers. One of the key findings was that 75% of PC systems are retired within 7 years, and 90% within 10 years of acquisition. Correspondingly, Intel�s internal goal is that the failure rates of systems in service be less than 1% cumulative at 7 years and less than 3% cumulative at 10 years.

Intel will begin certifying all new PC related package technologies, i.e., microprocessors, chipsets, and graphics with this improved methodology starting in Q1�99 and continuing throughout the year. The first processor to be certified with this methodology will be the Micro PGA technology (Dixon processor) in Q1�99. The non-PC related package technologies will lag by ~2 quarters and begin using this methodology in the Q2/Q3�99 time frame.

For additional information on this subject, please refer to the following Intel web page:

*Legal Information  |  Privacy Policy
©2002 Intel Corporation