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To begin another layer, a second, thinner layer of silicon dioxide is grown over the ridges and etched areas of the wafer base.
Then, a layer of polysilicon and another layer of photoresist are applied. |
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Ultraviolet light is then passed through a second mask, exposing a new pattern on the photoresist.
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The photoresist is dissolved with solvent to expose the polysilicon and silicon dioxide, which are then etched away with chemicals.
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The remaining photoresist is removed, leaving ridges of polysilicon and silicon dioxide.
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