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Intel® Celeron® processor Package
Integration Overview
July 1999
This overview is for professional system integrators building PCs with Intel® Celeron® processors and industry-accepted motherboards, chassis, and peripherals.
Intel Celeron Processor Features
The Intel Celeron processor family is Intel's new generation for value PC desktop systems.
The Intel Celeron processor is based upon the same Intel P6 microarchitecture on which the Pentium® II processor is based. It integrates the Dynamic Execution capabilities of the Pentium Pro processor with Intel MMX" media enhancement technology. Dynamic Execution expands on the superscalar architecture implemented in the Pentium processor. Dynamic Execution employs multiple branch prediction to anticipate jumps in the instruction flow, predicting where the next instructions can be found in memory. Dataflow analysis schedules execution of instructions when they are readyindependent of their original program order. Speculative execution increases the rate of program execution by looking ahead of the program counter, and executing instructions that are likely to be needed. The Intel Celeron processor brings today's technology to Value PC systems.
Intel's MMX Media Enhancement Technology facilitates the advanced 3D visualization and interactive capabilities required by many commercial and technical applications. MMX technology achieves this through a Single Instruction Multiple Data (SIMD) technique. It employs 57 new instructions, eight 64-bit wide MMX registers, and four new data types.
See the Introduction and Overview page to see the speeds that the Intel Celeron processor is currently available at. This document focuses on the Intel Boxed processor . The Intel Celeron processor in the S.E.P. package at 400 MHz, 366 MHz, 333 MHz and 300A MHz have an on-die 128-KB L2 cache and the Intel Celeron processor at 300 MHz and 266 MHz have no L2 cache. The "A" is added to the "300A MHz" of the Intel Celeron processor at 300A MHz to distinguish it as having an L2 cache while the Intel Celeron processor at 300 MHz does not have an L2 cache. Intel Celeron processors are packaged in a Single Edge Processor (S.E.P.) package. The Intel Celeron processor does not support dual processing.
For more information on the Intel Celeron processor in the Plastic Pin Grid Array (PPGA) package, see the Integration Overview for the Boxed Intel Celeron processor in the Plastic Pin Grid Array Package.
Boxed Intel Celeron Processor Contents
- Intel Celeron processor
- Attached active fan heatsink
- Fan power cable
- Installation manual
- Certificate of Authenticity
- Intel Inside� logo sticker
- 3-year limited warranty
Motherboard Selection
Motherboards used with Intel Celeron processors must meet Intel's published processor specifications. These specifications can be found in the Intel Celeron Processor Datasheet. A motherboard BIOS that does not properly identify the Intel Celeron processor may not be compatible with this processor. Motherboard vendors may provide a BIOS upgrade that properly identifies the processor as an Intel Celeron processor. Proper identification of the processor assures the individual system builder that the BIOS was written with Intel Celeron processor compatibility in mind.
For assured compatibility, Intel offers several boxed motherboards for operation with the Intel Celeron processor. These are ATX and microATX form-factor motherboards and include several designs for use with the boxed Intel Celeron processor.
Retention Mechanism Designs for the Single Edge Processor (S.E.P.) package
The retention mechanism holds the processor securely in the 242-contact slot connector (previously called Slot 1), and protects it and the motherboard from damage. The retention mechanism is not included with the boxed Intel Celeron processor. It should be provided, along with installation instructions, by your motherboard supplier.
The Intel Celeron processor requires retention mechanisms that attach to the heatsink rather than the processor package. To properly integrate the processor it is essential that the proper retention mechanisms be correctly installed on the motherboard. Contact the motherboard vendor to obtain retention mechanisms that properly support the Intel Celeron processor if they are not included with the motherboard. Installation instructions should be in the motherboard manual.
Chassis Selection
Selection of the proper chassis is an important considerationparticularly to provide for proper venting and airflow. We encourage individual system builders using ATX form-factor motherboards to choose a chassis that complies with the ATX 2.01 specification found on the ATX website. Individual system builders using microATX form-factor motherboards should choose a chassis that complies with the microATX 1.0 specification found on the microATX website. The ATX and microATX sites also lists chassis manufacturers.
Contact the motherboard vendor to obtain a compatible BIOS. The ATX website features a list of vendors who offer ATX motherboards.
Single Edge Processor (S.E.P.) package terminology and requirements
The Single Edge Processor package includes the substrate, the processor core, and any passive components mounted on the substrate (e.g. resistors and capacitors). The processor core is the execution engine of the processor. Passive components and the processor core are mounted on the processor substrate. The gold contacts on the bottom of the substrate provide the electrical connection to the 242-contact slot connector when the processor is installed.
It is important that proper handling procedures be followed when integrating an Intel Celeron processor. Be sure not to flex the substrate intentionally as this may damage the passive components and processor core. The Intel Celeron processor has components that are sensitive to electrostatic discharge (ESD). Take the proper precautions when handling the processor.
Since the retention mechanism for the S.E.P. package secures to and retains the heatsink, no additional heatsink supports are required. When using a motherboard with a pre-installed passive heatsink support, either remove the heatsink support prior to installation of the boxed Intel Celeron processor or verify that the heatsink support will not interfere with the boxed Intel Celeron processor fan heatsink.
Fan Heatsink Requirements
The boxed Intel Celeron processor is delivered with a fan heatsink specially designed to provide efficient cooling in a variety of thermal environments.
The fan power cable plugs into a 3-pin power header on the motherboard that supplies +12V and GND. The fan also transmits fan-speed information to motherboards that support fan speed detection. Your motherboard must have a 3-pin fan power header located close to the 242-contact slot connector. Refer to your motherboard manual for the location of the correct power header. Information on fan speed detection can be found in the Intel Celeron Processor Datasheet.
Electrical Requirements
When integrating an Intel Celeron processor, be sure to use a motherboard that specially supports the processor. Using a quality motherboard with specific support for the Intel Celeron processor will help ensure that the processor specifications are met by the motherboard. Using a motherboard that does not properly support the boxed Intel Celeron processor will void the warranty of the boxed processor. For complete specifications, see the Intel Celeron Processor Datasheet.
Selected Intel Celeron Processor Specifications
This information has been moved. See the Intel Celeron Processor S-spec Table for detailed information.
Proper voltage must be supplied for reliable operation. It may be supplied by a regulator integrated in the motherboard, or by a voltage regulator module (VRM) installed in Header 8 on the motherboard.
If the regulator is integrated in the motherboard, it must be Voltage ID (VID) programmable to allow the processor to program the correct voltage during power-on.
If the motherboard has Header 8, then a VRM must be installed in the header to power the processor. Most VRMs are VID-programmable. If your motherboard has a fixed-voltage VRM, its output voltage must match the processor requirements.
Since the operating voltage of Intel Celeron processors may be changed as the processor goes through stepping changes, VID-programmable voltage regulators are the preferred solution.
Thermal Management Considerations
Individual system builders must use a chassis that provides sufficient airflow to keep the processor under its maximum operating temperature (85�C measured at the center of the processor case beneath the heatsink) in the warmest user environment. If the temperature at the inlet of the boxed Intel Celeron processor fan heatsink is kept below 45�C, the processor core temperature will remain below its maximum operating temperature. Running the processor above its maximum temperature specification will void the warranty and can lead to functional and performance degradation. Intel recommends the use of ATX 2.01-compliant or microATX 1.0-compliant motherboards and chassis for proper mechanical fit.
An ATX form-factor motherboard with an ATX 2.01-compliant chassis, or a microATX form-factor motherboard with a microATX 1.0-compliant chassis can provide a good thermal management solution for the boxed Intel Celeron processor.
If you use Baby AT motherboards, be aware that the airflow in different Baby AT chassis varies significantlydepending on venting, internal brackets, and other factors. Chassis with low airflow can cause processors to run warmer than their maximum specification.
Thermal testing should always be performed when selecting a chassis for Intel Celeron processor-based systems. Refer to Thermal Management for Intel Celeron Processor-Based PCs for more information.
Installation and Removal
Installation and removal may vary slightly based on the retention mechanisms provided by the motherboard manufacturer. These guidelines assume the use of S.E.P. retention mechanisms. Installation into other types of retention mechanisms is similar. Motherboard manuals should have instructions on inserting the processor into the 242-contact slot connector with the retention mechanisms that shipped with the motherboard.
Installation:
Install the retention mechanism(s) onto the motherboard using the motherboard manufacturer's instructions. Install the processor into the 242-contact slot connector. Make sure to install the heatsink into the retention mechanism and the processor substrate into the 242-contact slot connector. Do not bend the processor package. Install the processor fan cable to the motherboard connector and the fan heatsink. Quickly power on the system to verify that the processor fan is running.
Removal:
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Figure 1. Boxed Processor Removal Process
Pull one of the retention mechanisms away from the processor with one hand. Then rotate the processor out of the 242-contact slot connector with the other. Figures 2 through 5 show how to remove the boxed Intel Celeron processor.
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Figure 2. The Boxed Intel Celeron Processor Installed in a Motherboard
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Figure 3. Hold the Fan Heatsink
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Figure 4. Pull the Retention Mechanism Away From the Processor
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Figure 5. Rotate the Processor Out of the 242-contact slot connector.
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The retention mechanisms provide firm mechanical support for the processor.
NOTICE: If you find that considerable force is required to remove the processor, consider wearing gloves to protect your hands and take care to keep your hands away from any metal edges on the chassis and processor package when uninstalling the processor from the retention mechanisms. Loosening or removing one of the retention mechanisms greatly reduces the force required to remove the processor. To loosen retention mechanisms with brass captive fasteners, simply unscrew the nuts with a screwdriver. Removing retention mechanisms with plastic fasteners requires the removal of the motherboard from the chassis. Once the motherboard is removed and while viewing the underside of the motherboard, use the tip of a ballpoint pen or other tool to carefully push the bottom of the white pin insert out of the black plastic fastener sleeve. Once the white insert pins are removed, carefully push the black sleeve portion of the fastener out of the motherboard to free the retention mechanism.
BIOS Considerations
BIOS code on the Intel Celeron processor-based motherboards contains data that is specific to a processor silicon stepping. (A silicon stepping is a specific revision of the silicon.) You must ensure that this stepping data matches the processor stepping used. When the stepping data does not match the processor stepping, you must update the data before shipping the system.
Motherboard vendors can supply information about the default stepping of the Intel Celeron processor supported by the BIOS on a specific motherboard. If the default stepping data does not match the processor stepping used, the motherboard vendor can supply a system BIOS upgrade for the motherboard. Make sure to specify the processor speed and stepping that you are currently using.
Stepping Information
Currently there are several steppings of the Intel Celeron processor. Information about steppings and test specifications can be found in the Intel® Celeron Processor Specification Update.
For stepping information on the Intel Celeron Processor, see the Intel Celeron Processor S-spec Table.
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